An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging

Several design parameters affect the reliability of wafer-level type advanced packaging, such as upper and lower pad sizes, solder volume, buffer layer thickness, and chip thickness, etc. Conventionally, the accelerated thermal cycling test (ATCT) is used to evaluate the reliability life of electron...

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Detalles Bibliográficos
Autores principales: Panigrahy, Sunil Kumar, Tseng, Yi-Chieh, Lai, Bo-Ruei, Chiang, Kuo-Ning
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8472661/
https://www.ncbi.nlm.nih.gov/pubmed/34576571
http://dx.doi.org/10.3390/ma14185342

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8472661/
https://www.ncbi.nlm.nih.gov/pubmed/34576571
http://dx.doi.org/10.3390/ma14185342

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