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A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging

Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork microelectromechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetri...

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Detalles Bibliográficos
Autores principales:	Xu, Pengfei, Si, Chaowei, He, Yurong, Wei, Zhenyu, Jia, Lu, Han, Guowei, Ning, Jin, Yang, Fuhua
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8512718/ https://www.ncbi.nlm.nih.gov/pubmed/34640747 http://dx.doi.org/10.3390/s21196428

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