Microbial growth and volatile organic compound (VOC) emissions from carpet and drywall under elevated relative humidity conditions

BACKGROUND: Microbes can grow in indoor environments if moisture is available, and we need an improved understanding of how this growth contributes to emissions of microbial volatile organic compounds (mVOCs). The goal of this study was to measure how moisture levels, building material type, collection site, and microbial species composition impact microbial growth and emissions of mVOCs. We subjected two common building materials, drywall, and carpet, to treatments with varying moisture availability and measured microbial communities and mVOC emissions. RESULTS: Fungal growth occurred in samples at >75% equilibrium relative humidity (ERH) for carpet with dust and >85% ERH for inoculated painted drywall. In addition to incubated relative humidity level, dust sample collection site (adonis p=0.001) and material type (drywall, carpet, adonis p=0.001) drove fungal and bacterial species composition. Increased relative humidity was associated with decreased microbial species diversity in samples of carpet with dust (adonis p= 0.005). Abundant volatile organic compounds (VOCs) that accounted for >1% emissions were likely released from building materials and the dust itself. However, certain mVOCs were associated with microbial growth from carpet with dust such as C(10)H(16)H(+) (monoterpenes) and C(2)H(6)SH(+) (dimethyl sulfide and ethanethiol). CO(2) production from samples of carpet with dust at 95% ERH averaged 5.92 mg hr(-1) kg(-1), while the average for carpet without dust at 95% ERH was 2.55 mg hr(-1) kg(-1). CONCLUSION: Microbial growth and mVOC emissions occur at lower relative humidity in carpet and floor dust compared to drywall, which has important implications for human exposure. Even under elevated relative humidity conditions, the VOC emissions profile is dominated by non-microbial VOCs, although potential mVOCs may dominate odor production. SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1186/s40168-021-01158-y.