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Integration Technology for Wafer-Level LiNbO(3) Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing

An integration technology for wafer-level LiNbO(3) single-crystal thin film on Si has been achieved. The optimized spin-coating speed of PI (polyimide) adhesive is 3500 rad/min. According to Fourier infrared analysis of the chemical state of the film baked under different conditions, a high-quality...

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Detalles Bibliográficos
Autores principales:	Geng, Wenping, Yang, Xiangyu, Xue, Gang, Xu, Wenhao, Bi, Kaixi, Mei, Linyu, Zhang, Le, Hou, Xiaojuan, Chou, Xiujian
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8537918/ https://www.ncbi.nlm.nih.gov/pubmed/34685009 http://dx.doi.org/10.3390/nano11102554

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