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An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias

An accurate equivalent thermal model is proposed to calculate the equivalent thermal conductivity (ETC) of shield differential through-silicon via (SDTSV). The mathematical expressions of ETC in both horizontal and vertical directions are deduced by considering the anisotropy of SDTSV. The accuracy...

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Detalles Bibliográficos
Autores principales: Shan, Guangbao, Li, Guoliang, Chen, Dongdong, Yang, Zifeng, Li, Di, Yang, Yintang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8540555/
https://www.ncbi.nlm.nih.gov/pubmed/34683274
http://dx.doi.org/10.3390/mi12101223

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