Cargando…

The packaging and clean method contribute to insulation failure of electrosurgical instruments

With the rapid development of medical technology, the use of electrosurgical instruments is dramatically increased in various types of surgery. However, the damage of the insulation layer of the reusable electrosurgical instrument often causes surgical accidents. The procedures of packaging and clea...

Descripción completa

Detalles Bibliográficos
Autores principales: Zhang, Ying, Zhang, Yanyan, Wang, Yafei, Yang, Lili, Hu, Ruying
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Lippincott Williams & Wilkins 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8542112/
https://www.ncbi.nlm.nih.gov/pubmed/34678880
http://dx.doi.org/10.1097/MD.0000000000027492
_version_ 1784589371801862144
author Zhang, Ying
Zhang, Yanyan
Wang, Yafei
Yang, Lili
Hu, Ruying
author_facet Zhang, Ying
Zhang, Yanyan
Wang, Yafei
Yang, Lili
Hu, Ruying
author_sort Zhang, Ying
collection PubMed
description With the rapid development of medical technology, the use of electrosurgical instruments is dramatically increased in various types of surgery. However, the damage of the insulation layer of the reusable electrosurgical instrument often causes surgical accidents. The procedures of packaging and cleaning contribute to many damages to insulating layer of reusable electrosurgical instruments. Various types of reusable electrosurgical instruments were detected for insulation failures, conduction failures, short-circuit by using a high-voltage detector, DIATEG (Morgate company). In addition, reusable electrosurgical instruments were detected for insulation failures after packaging and cleaning by different procedures. 13.1% (129/740) electrosurgical instruments had an insulation test failure; 6.2% (9/146) monopolar wires were with conduction failure; and 7.7% (16/207) bipolar wires were with short-circuit. Different packaging and cleaning procedures contribute to various degrees of damages to insulating property of reusable electrosurgical instruments. Insulation failure was a wide problem of reusable electrosurgical instruments, while fixed packaging method and mild cleaning procedures result in fewer damages to insulating property of reusable electrosurgical instruments.
format Online
Article
Text
id pubmed-8542112
institution National Center for Biotechnology Information
language English
publishDate 2021
publisher Lippincott Williams & Wilkins
record_format MEDLINE/PubMed
spelling pubmed-85421122021-10-25 The packaging and clean method contribute to insulation failure of electrosurgical instruments Zhang, Ying Zhang, Yanyan Wang, Yafei Yang, Lili Hu, Ruying Medicine (Baltimore) 3200 With the rapid development of medical technology, the use of electrosurgical instruments is dramatically increased in various types of surgery. However, the damage of the insulation layer of the reusable electrosurgical instrument often causes surgical accidents. The procedures of packaging and cleaning contribute to many damages to insulating layer of reusable electrosurgical instruments. Various types of reusable electrosurgical instruments were detected for insulation failures, conduction failures, short-circuit by using a high-voltage detector, DIATEG (Morgate company). In addition, reusable electrosurgical instruments were detected for insulation failures after packaging and cleaning by different procedures. 13.1% (129/740) electrosurgical instruments had an insulation test failure; 6.2% (9/146) monopolar wires were with conduction failure; and 7.7% (16/207) bipolar wires were with short-circuit. Different packaging and cleaning procedures contribute to various degrees of damages to insulating property of reusable electrosurgical instruments. Insulation failure was a wide problem of reusable electrosurgical instruments, while fixed packaging method and mild cleaning procedures result in fewer damages to insulating property of reusable electrosurgical instruments. Lippincott Williams & Wilkins 2021-10-22 /pmc/articles/PMC8542112/ /pubmed/34678880 http://dx.doi.org/10.1097/MD.0000000000027492 Text en Copyright © 2021 the Author(s). Published by Wolters Kluwer Health, Inc. https://creativecommons.org/licenses/by-nc/4.0/This is an open access article distributed under the terms of the Creative Commons Attribution-Non Commercial License 4.0 (CCBY-NC), where it is permissible to download, share, remix, transform, and buildup the work provided it is properly cited. The work cannot be used commercially without permission from the journal. http://creativecommons.org/licenses/by-nc/4.0 (https://creativecommons.org/licenses/by-nc/4.0/)
spellingShingle 3200
Zhang, Ying
Zhang, Yanyan
Wang, Yafei
Yang, Lili
Hu, Ruying
The packaging and clean method contribute to insulation failure of electrosurgical instruments
title The packaging and clean method contribute to insulation failure of electrosurgical instruments
title_full The packaging and clean method contribute to insulation failure of electrosurgical instruments
title_fullStr The packaging and clean method contribute to insulation failure of electrosurgical instruments
title_full_unstemmed The packaging and clean method contribute to insulation failure of electrosurgical instruments
title_short The packaging and clean method contribute to insulation failure of electrosurgical instruments
title_sort packaging and clean method contribute to insulation failure of electrosurgical instruments
topic 3200
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8542112/
https://www.ncbi.nlm.nih.gov/pubmed/34678880
http://dx.doi.org/10.1097/MD.0000000000027492
work_keys_str_mv AT zhangying thepackagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT zhangyanyan thepackagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT wangyafei thepackagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT yanglili thepackagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT huruying thepackagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT zhangying packagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT zhangyanyan packagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT wangyafei packagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT yanglili packagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments
AT huruying packagingandcleanmethodcontributetoinsulationfailureofelectrosurgicalinstruments