Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion

The salt-film and water acceptor mechanisms were generally accepted mechanisms for Cu electrochemical polishing (ECP) theory. These mechanisms of Cu ECP are still controversial for a long time. Conventional and new electrochemical analysis methods were used to investigate the mechanisms and behavior...

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Detalles Bibliográficos
Autores principales: Park, Kimoon, Lee, Jinhyun, Kim, Youjung, Yoon, Sangwha, Yoo, Bongyoung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Frontiers Media S.A. 2021
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8566973/
https://www.ncbi.nlm.nih.gov/pubmed/34746096
http://dx.doi.org/10.3389/fchem.2021.763508

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8566973/
https://www.ncbi.nlm.nih.gov/pubmed/34746096
http://dx.doi.org/10.3389/fchem.2021.763508

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