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Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

In microelectronic packaging technology for three-dimensional integrated circuits (3D ICs), Cu-to-Cu direct bonding appears to be the solution to solve the problems of Joule heating and electromigration (EM) in solder microbumps under 10 [Formula: see text] in diameter. However, EM will occur in Cu–...

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Detalles Bibliográficos
Autores principales:	Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tu, K. N., Chen, Chih
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8585211/ https://www.ncbi.nlm.nih.gov/pubmed/34771919 http://dx.doi.org/10.3390/ma14216394

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