UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance spectroscopy, as a well-established method, w...

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Detalles Bibliográficos
Autores principales: Al Ktash, Mohammad, Stefanakis, Mona, Englert, Tim, Drechsel, Maryam S. L., Stiedl, Jan, Green, Simon, Jacob, Timo, Boldrini, Barbara, Ostertag, Edwin, Rebner, Karsten, Brecht, Marc
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8588143/
https://www.ncbi.nlm.nih.gov/pubmed/34770640
http://dx.doi.org/10.3390/s21217332

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