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Structural optimization of silicon thin film for thermoelectric materials

The method to optimize nanostructures of silicon thin films as thermoelectric materials is developed. The simulated annealing method is utilized for predicting the optimized structure. The mean free path and thermal conductivity of thin films, which are the objective function of optimization, is eva...

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Autor principal: Hori, Takuma
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8608789/
https://www.ncbi.nlm.nih.gov/pubmed/34811398
http://dx.doi.org/10.1038/s41598-021-01855-6
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author Hori, Takuma
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description The method to optimize nanostructures of silicon thin films as thermoelectric materials is developed. The simulated annealing method is utilized for predicting the optimized structure. The mean free path and thermal conductivity of thin films, which are the objective function of optimization, is evaluated by using phonon transport simulations and lattice dynamics calculations. In small systems composed of square lattices, the simulated annealing method successfully predicts optimized structure corroborated by an exhaustive search. This fact indicates that the simulated annealing method is an effective tool for optimizing nanostructured thin films as thermoelectric materials.
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spelling pubmed-86087892021-11-24 Structural optimization of silicon thin film for thermoelectric materials Hori, Takuma Sci Rep Article The method to optimize nanostructures of silicon thin films as thermoelectric materials is developed. The simulated annealing method is utilized for predicting the optimized structure. The mean free path and thermal conductivity of thin films, which are the objective function of optimization, is evaluated by using phonon transport simulations and lattice dynamics calculations. In small systems composed of square lattices, the simulated annealing method successfully predicts optimized structure corroborated by an exhaustive search. This fact indicates that the simulated annealing method is an effective tool for optimizing nanostructured thin films as thermoelectric materials. Nature Publishing Group UK 2021-11-22 /pmc/articles/PMC8608789/ /pubmed/34811398 http://dx.doi.org/10.1038/s41598-021-01855-6 Text en © The Author(s) 2021 https://creativecommons.org/licenses/by/4.0/Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Article
Hori, Takuma
Structural optimization of silicon thin film for thermoelectric materials
title Structural optimization of silicon thin film for thermoelectric materials
title_full Structural optimization of silicon thin film for thermoelectric materials
title_fullStr Structural optimization of silicon thin film for thermoelectric materials
title_full_unstemmed Structural optimization of silicon thin film for thermoelectric materials
title_short Structural optimization of silicon thin film for thermoelectric materials
title_sort structural optimization of silicon thin film for thermoelectric materials
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8608789/
https://www.ncbi.nlm.nih.gov/pubmed/34811398
http://dx.doi.org/10.1038/s41598-021-01855-6
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