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Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

[Image: see text] Clarification of adhesive interactions in semiconductor packages can improve reliability of power electronics. In this study, the adhesion interfaces between the epoxy molding compound and Cu-based lead frames were analyzed using the density functional theory. A resin fragment was...

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Detalles Bibliográficos
Autores principales:	Tsurumi, Naoaki, Tsuji, Yuta, Masago, Noriyuki, Yoshizawa, Kazunari
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	American Chemical Society 2021
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8675159/ https://www.ncbi.nlm.nih.gov/pubmed/34926965 http://dx.doi.org/10.1021/acsomega.1c05914

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