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Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level

Metallic nanogaps with metal–metal separations of less than 10 nm have many applications in nanoscale photonics and electronics. However, their fabrication remains a considerable challenge, especially for applications that require patterning of nanoscale features over macroscopic length‐scales. Here...

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Detalles Bibliográficos
Autores principales: Luo, Sihai, Hoff, Bård H., Maier, Stefan A., de Mello, John C.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8693066/
https://www.ncbi.nlm.nih.gov/pubmed/34719889
http://dx.doi.org/10.1002/advs.202102756
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author Luo, Sihai
Hoff, Bård H.
Maier, Stefan A.
de Mello, John C.
author_facet Luo, Sihai
Hoff, Bård H.
Maier, Stefan A.
de Mello, John C.
author_sort Luo, Sihai
collection PubMed
description Metallic nanogaps with metal–metal separations of less than 10 nm have many applications in nanoscale photonics and electronics. However, their fabrication remains a considerable challenge, especially for applications that require patterning of nanoscale features over macroscopic length‐scales. Here, some of the most promising techniques for nanogap fabrication are evaluated, covering established technologies such as photolithography, electron‐beam lithography (EBL), and focused ion beam (FIB) milling, plus a number of newer methods that use novel electrochemical and mechanical means to effect the patterning. The physical principles behind each method are reviewed and their strengths and limitations for nanogap patterning in terms of resolution, fidelity, speed, ease of implementation, versatility, and scalability to large substrate sizes are discussed.
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spelling pubmed-86930662022-01-03 Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level Luo, Sihai Hoff, Bård H. Maier, Stefan A. de Mello, John C. Adv Sci (Weinh) Reviews Metallic nanogaps with metal–metal separations of less than 10 nm have many applications in nanoscale photonics and electronics. However, their fabrication remains a considerable challenge, especially for applications that require patterning of nanoscale features over macroscopic length‐scales. Here, some of the most promising techniques for nanogap fabrication are evaluated, covering established technologies such as photolithography, electron‐beam lithography (EBL), and focused ion beam (FIB) milling, plus a number of newer methods that use novel electrochemical and mechanical means to effect the patterning. The physical principles behind each method are reviewed and their strengths and limitations for nanogap patterning in terms of resolution, fidelity, speed, ease of implementation, versatility, and scalability to large substrate sizes are discussed. John Wiley and Sons Inc. 2021-10-31 /pmc/articles/PMC8693066/ /pubmed/34719889 http://dx.doi.org/10.1002/advs.202102756 Text en © 2021 The Authors. Advanced Science published by Wiley‐VCH GmbH https://creativecommons.org/licenses/by/4.0/This is an open access article under the terms of the http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.
spellingShingle Reviews
Luo, Sihai
Hoff, Bård H.
Maier, Stefan A.
de Mello, John C.
Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level
title Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level
title_full Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level
title_fullStr Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level
title_full_unstemmed Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level
title_short Scalable Fabrication of Metallic Nanogaps at the Sub‐10 nm Level
title_sort scalable fabrication of metallic nanogaps at the sub‐10 nm level
topic Reviews
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8693066/
https://www.ncbi.nlm.nih.gov/pubmed/34719889
http://dx.doi.org/10.1002/advs.202102756
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