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All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience
Ultimately soft electronics seek affordable and high mechanical performance universal self‐healing materials that can autonomously heal in harsh environments within short times scales. As of now, such features are not found in a single material. Herein, interpenetrated elastomer network with bimodal...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
John Wiley and Sons Inc.
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8693070/ https://www.ncbi.nlm.nih.gov/pubmed/34664423 http://dx.doi.org/10.1002/advs.202103235 |
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author | Tolvanen, Jarkko Nelo, Mikko Hannu, Jari Juuti, Jari Jantunen, Heli |
author_facet | Tolvanen, Jarkko Nelo, Mikko Hannu, Jari Juuti, Jari Jantunen, Heli |
author_sort | Tolvanen, Jarkko |
collection | PubMed |
description | Ultimately soft electronics seek affordable and high mechanical performance universal self‐healing materials that can autonomously heal in harsh environments within short times scales. As of now, such features are not found in a single material. Herein, interpenetrated elastomer network with bimodal chain length distribution showing rapid autonomous healing in universal conditions (<7200 s) with high efficiency (up to 97.6 ± 4.8%) is reported. The bimodal elastomer displays strain‐induced photoelastic effect and reinforcement which is responsible for its remarkable mechanical robustness (≈5.5 MPa stress at break and toughness ≈30 MJ m(−3)). The entropy‐driven elasticity allows an unprecedented shape recovery efficiency (100%) even after fracturing and 100% resiliency up to its stretching limit (≈2000% strain). The elastomers can be mechanically conditioned leading to a state where they recover their shape extremely quickly after removal of stress (nearly order of magnitude faster than pristine elastomers). As a proof of concept, universal self‐healing mechanochromic strain sensor is developed capable of operating in various environmental conditions and of changing its photonic band gap under mechanical stress. |
format | Online Article Text |
id | pubmed-8693070 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | John Wiley and Sons Inc. |
record_format | MEDLINE/PubMed |
spelling | pubmed-86930702022-01-03 All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience Tolvanen, Jarkko Nelo, Mikko Hannu, Jari Juuti, Jari Jantunen, Heli Adv Sci (Weinh) Research Articles Ultimately soft electronics seek affordable and high mechanical performance universal self‐healing materials that can autonomously heal in harsh environments within short times scales. As of now, such features are not found in a single material. Herein, interpenetrated elastomer network with bimodal chain length distribution showing rapid autonomous healing in universal conditions (<7200 s) with high efficiency (up to 97.6 ± 4.8%) is reported. The bimodal elastomer displays strain‐induced photoelastic effect and reinforcement which is responsible for its remarkable mechanical robustness (≈5.5 MPa stress at break and toughness ≈30 MJ m(−3)). The entropy‐driven elasticity allows an unprecedented shape recovery efficiency (100%) even after fracturing and 100% resiliency up to its stretching limit (≈2000% strain). The elastomers can be mechanically conditioned leading to a state where they recover their shape extremely quickly after removal of stress (nearly order of magnitude faster than pristine elastomers). As a proof of concept, universal self‐healing mechanochromic strain sensor is developed capable of operating in various environmental conditions and of changing its photonic band gap under mechanical stress. John Wiley and Sons Inc. 2021-10-18 /pmc/articles/PMC8693070/ /pubmed/34664423 http://dx.doi.org/10.1002/advs.202103235 Text en © 2021 The Authors. Advanced Science published by Wiley‐VCH GmbH https://creativecommons.org/licenses/by/4.0/This is an open access article under the terms of the http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited. |
spellingShingle | Research Articles Tolvanen, Jarkko Nelo, Mikko Hannu, Jari Juuti, Jari Jantunen, Heli All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience |
title | All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience |
title_full | All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience |
title_fullStr | All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience |
title_full_unstemmed | All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience |
title_short | All‐Around Universal and Photoelastic Self‐Healing Elastomer with High Toughness and Resilience |
title_sort | all‐around universal and photoelastic self‐healing elastomer with high toughness and resilience |
topic | Research Articles |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8693070/ https://www.ncbi.nlm.nih.gov/pubmed/34664423 http://dx.doi.org/10.1002/advs.202103235 |
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