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Study on the Mechanism of Solid-Phase Oxidant Action in Tribochemical Mechanical Polishing of SiC Single Crystal Substrate
Na(2)CO(3)—1.5 H(2)O(2), KClO(3), KMnO(4), KIO(3), and NaOH were selected for dry polishing tests with a 6H-SiC single crystal substrate on a polyurethane polishing pad. The research results showed that all the solid-phase oxidants, except NaOH, could decompose to produce oxygen under the frictional...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8703796/ https://www.ncbi.nlm.nih.gov/pubmed/34945397 http://dx.doi.org/10.3390/mi12121547 |
Sumario: | Na(2)CO(3)—1.5 H(2)O(2), KClO(3), KMnO(4), KIO(3), and NaOH were selected for dry polishing tests with a 6H-SiC single crystal substrate on a polyurethane polishing pad. The research results showed that all the solid-phase oxidants, except NaOH, could decompose to produce oxygen under the frictional action. After polishing with the five solid-phase oxidants, oxygen was found on the surface of SiC, indicating that all five solid-phase oxidants can have complex tribochemical reactions with SiC. Their reaction products are mainly SiO(2) and (SiO(2))x. Under the action of friction, due to the high flash point temperature of the polishing interface, the oxygen generated by the decomposition of the solid-phase oxidant could oxidize the surface of SiC and generate a SiO(2) oxide layer on the surface of SiC. On the other hand, SiC reacted with H(2)O and generated a SiO(2) oxide layer on the surface of SiC. After polishing with NaOH, the SiO(2) oxide layer and soluble Na(2)SiO(3) could be generated on the SiC surface; therefore, the surface material removal rate (MRR) was the highest, and the surface roughness was the largest, after polishing. The lowest MRR was achieved after the dry polishing of SiC with KClO(3). |
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