Interfacial Characteristics and Mechanical Properties of CuSn15/HT250 Prepared via Additive Manufacturing Combined with an Inconel 718 Interlayer

Tremendous discrepancies in the positive enthalpy of mixing and the coefficient of thermal expansion emerge between the copper alloy and the gray cast iron, accounting for numerous pores and cracks in the interfacial region during the metallurgical bonding process. To enhance the interfacial bonding properties of these two refractory materials, laser-directed energy deposition was applied to fabricate the CuSn15 alloy on the HT250 substrate; meanwhile, Inconel 718 alloy, acting as the interlayer, was added to their bonding region. Firstly, the effect of the deposition process on deposition layer quality was investigated, and then the effects of Inconel 718 addition on the interfacial morphology, element distribution, phase composition, bonding strength, microhardness were studied. The results showed that a substrate (HT250) without cracks and a deposition layer (CuSn15) free from pores could be obtained via parameter optimization combined with preheating and slow cooling processes. Adding the Inconel 718 interlayer eliminated the interfacial pores and cracks, facilitated interfacial element (Cu, Fe, Ni) diffusion, and enhanced interfacial bonding strength. The interface between HT250 and CuSn15 mainly contained the FeSn(2) phase, while the interfaces of the CuSn15-Inconel 718 and the Inconel 718-HT250 were mainly composed of the Ni(3)Sn(4), Cr(5)Si(3), FeSi(2), Cr(7)C(3). The microhardness and fracture morphology of the interfacial region in the samples with and without the interlayer were also studied. Finally, CuSn15 was also successfully deposited on the surface of the HT250 impeller with large size and complex structure, which was applied in the root blower.