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Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact

The current lead insulation of high-temperature superconductivity equipment is under the combined action of large temperature gradient field and strong electric field. Compared with a uniform temperature field, its electric field distortion is more serious, and it is easy to induce surface discharge...

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Autores principales: Xing, Yunqi, Chen, Yuanyuan, Chi, Jiakai, Zheng, Jingquan, Zhu, Wenbo, Wang, Xiaoxue
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8705859/
https://www.ncbi.nlm.nih.gov/pubmed/34960890
http://dx.doi.org/10.3390/polym13244339
_version_ 1784622050939240448
author Xing, Yunqi
Chen, Yuanyuan
Chi, Jiakai
Zheng, Jingquan
Zhu, Wenbo
Wang, Xiaoxue
author_facet Xing, Yunqi
Chen, Yuanyuan
Chi, Jiakai
Zheng, Jingquan
Zhu, Wenbo
Wang, Xiaoxue
author_sort Xing, Yunqi
collection PubMed
description The current lead insulation of high-temperature superconductivity equipment is under the combined action of large temperature gradient field and strong electric field. Compared with a uniform temperature field, its electric field distortion is more serious, and it is easy to induce surface discharge to generate high-energy particles, destroy the insulation surface structure and accelerate insulation degradation. In this paper, the degradation reaction process of bisphenol F epoxy resin under the impact of high-energy particles, such as O(3)(−), HO(–), H(3)O(+) and NO(+), is calculated based on ReaxFF simulation. According to the different types of high-energy particles under different voltage polarities, the micro-degradation mechanism, pyrolysis degree and pyrolysis products of epoxy resin are analyzed. The results show that in addition to the chemical reaction of high-energy particles with epoxy resin, their kinetic energy will also destroy the molecular structure of the material, causing the cross-linked epoxy resin to pyrolyze, and the impact of positive particles has a more obvious impact on the pyrolysis of epoxy resin.
format Online
Article
Text
id pubmed-8705859
institution National Center for Biotechnology Information
language English
publishDate 2021
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-87058592021-12-25 Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact Xing, Yunqi Chen, Yuanyuan Chi, Jiakai Zheng, Jingquan Zhu, Wenbo Wang, Xiaoxue Polymers (Basel) Article The current lead insulation of high-temperature superconductivity equipment is under the combined action of large temperature gradient field and strong electric field. Compared with a uniform temperature field, its electric field distortion is more serious, and it is easy to induce surface discharge to generate high-energy particles, destroy the insulation surface structure and accelerate insulation degradation. In this paper, the degradation reaction process of bisphenol F epoxy resin under the impact of high-energy particles, such as O(3)(−), HO(–), H(3)O(+) and NO(+), is calculated based on ReaxFF simulation. According to the different types of high-energy particles under different voltage polarities, the micro-degradation mechanism, pyrolysis degree and pyrolysis products of epoxy resin are analyzed. The results show that in addition to the chemical reaction of high-energy particles with epoxy resin, their kinetic energy will also destroy the molecular structure of the material, causing the cross-linked epoxy resin to pyrolyze, and the impact of positive particles has a more obvious impact on the pyrolysis of epoxy resin. MDPI 2021-12-11 /pmc/articles/PMC8705859/ /pubmed/34960890 http://dx.doi.org/10.3390/polym13244339 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Xing, Yunqi
Chen, Yuanyuan
Chi, Jiakai
Zheng, Jingquan
Zhu, Wenbo
Wang, Xiaoxue
Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact
title Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact
title_full Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact
title_fullStr Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact
title_full_unstemmed Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact
title_short Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact
title_sort molecular dynamics simulation of cracking process of bisphenol f epoxy resin under high-energy particle impact
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8705859/
https://www.ncbi.nlm.nih.gov/pubmed/34960890
http://dx.doi.org/10.3390/polym13244339
work_keys_str_mv AT xingyunqi moleculardynamicssimulationofcrackingprocessofbisphenolfepoxyresinunderhighenergyparticleimpact
AT chenyuanyuan moleculardynamicssimulationofcrackingprocessofbisphenolfepoxyresinunderhighenergyparticleimpact
AT chijiakai moleculardynamicssimulationofcrackingprocessofbisphenolfepoxyresinunderhighenergyparticleimpact
AT zhengjingquan moleculardynamicssimulationofcrackingprocessofbisphenolfepoxyresinunderhighenergyparticleimpact
AT zhuwenbo moleculardynamicssimulationofcrackingprocessofbisphenolfepoxyresinunderhighenergyparticleimpact
AT wangxiaoxue moleculardynamicssimulationofcrackingprocessofbisphenolfepoxyresinunderhighenergyparticleimpact