Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO(2)-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization

For scaling-down advanced nanoscale semiconductor devices, tungsten (W)-film surface chemical mechanical planarization (CMP) has rapidly evolved to increase the W-film surface polishing rate via Fenton-reaction acceleration and enhance nanoscale-abrasive (i.e., ZrO(2)) dispersant stability in the CM...

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Detalles Bibliográficos
Autores principales: Kim, Seong-In, Jeong, Gi-Ppeum, Lee, Seung-Jae, Lee, Jong-Chan, Lee, Jun-Myeong, Park, Jin-Hyung, Bae, Jae-Young, Park, Jea-Gun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8706925/
https://www.ncbi.nlm.nih.gov/pubmed/34947644
http://dx.doi.org/10.3390/nano11123296

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8706925/
https://www.ncbi.nlm.nih.gov/pubmed/34947644
http://dx.doi.org/10.3390/nano11123296

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