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Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO(2)-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization
For scaling-down advanced nanoscale semiconductor devices, tungsten (W)-film surface chemical mechanical planarization (CMP) has rapidly evolved to increase the W-film surface polishing rate via Fenton-reaction acceleration and enhance nanoscale-abrasive (i.e., ZrO(2)) dispersant stability in the CM...
Autores principales: | Kim, Seong-In, Jeong, Gi-Ppeum, Lee, Seung-Jae, Lee, Jong-Chan, Lee, Jun-Myeong, Park, Jin-Hyung, Bae, Jae-Young, Park, Jea-Gun |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8706925/ https://www.ncbi.nlm.nih.gov/pubmed/34947644 http://dx.doi.org/10.3390/nano11123296 |
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