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Optical Pulling Using Chiral Metalens as a Photonic Probe

Optical pulling forces, which can pull objects in the source direction, have emerged as an intensively explored field in recent years. Conventionally, optical pulling forces exerted on objects can be achieved by tailoring the properties of an electromagnetic field, the surrounding environment, or th...

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Detalles Bibliográficos
Autores principales: Peng, Miao, Luo, Hui, Zhang, Zhaojian, Kuang, Tengfang, Chen, Dingbo, Bai, Wei, Chen, Zhijie, Yang, Junbo, Xiao, Guangzong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8707173/
https://www.ncbi.nlm.nih.gov/pubmed/34947726
http://dx.doi.org/10.3390/nano11123376
Descripción
Sumario:Optical pulling forces, which can pull objects in the source direction, have emerged as an intensively explored field in recent years. Conventionally, optical pulling forces exerted on objects can be achieved by tailoring the properties of an electromagnetic field, the surrounding environment, or the particles themselves. Recently, the idea of applying conventional lenses or prisms as photonic probes has been proposed to realize an optical pulling force. However, their sizes are far beyond the scope of optical manipulation. Here, we design a chiral metalens as the photonic probe to generate a robust optical pulling force. The induced pulling force exerted on the metalens, characterized by a broadband spectrum over 0.6 μm (from 1.517 to 2.117 μm) bandwidth, reached a maximum value of −83.76 pN/W. Moreover, under the illumination of incident light with different circular polarization states, the longitudinal optical force acting on the metalens showed a circular dichroism response. This means that the longitudinal optical force can be flexibly tuned from a pulling force to a pushing force by controlling the polarization of the incident light. This work could pave the way for a new advanced optical manipulation technique, with potential applications ranging from contactless wafer-scale fabrication to cell assembly and even course control for spacecraft.