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Effects of Different Types of Interlayers on the Interfacial Reaction Mechanism at the Cu Side of Al/Cu Lap Joints Obtained by Laser Welding/Brazing

The influence of tin foil and Ni coatings on microstructures, mechanical properties, and the interfacial reaction mechanism was investigated during laser welding/brazing of Al/Cu lap joints. In the presence of a Zn-based filler, tin foil as well as Ni coating strengthened the Al/Cu joints. The tin f...

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Detalles Bibliográficos
Autores principales: Zhu, Ruican, Guo, Shixiong, Huang, Chao, Lei, Zhenglong, Zhang, Xinrui, Liu, Jinge
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8707775/
https://www.ncbi.nlm.nih.gov/pubmed/34947389
http://dx.doi.org/10.3390/ma14247797
Descripción
Sumario:The influence of tin foil and Ni coatings on microstructures, mechanical properties, and the interfacial reaction mechanism was investigated during laser welding/brazing of Al/Cu lap joints. In the presence of a Zn-based filler, tin foil as well as Ni coating strengthened the Al/Cu joints. The tin foil only slightly influenced the joint strength. It considerably improved the spreading/wetting ability of the weld filler; however, it weakened the bonding between the seam and the Al base metal. The Ni coating considerably strengthened the Al/Cu lap joints; the highest tensile strength was 171 MPa, which was higher by 15.5% than that of a joint without any interlayer. Microstructure analysis revealed that composite layers of Ni(3)Zn(14)–(τ(2) Zn–Ni–Al ternary phase)–(α-Zn solid solution)–Al(3)Ni formed at the fusion zone (FZ)/Cu interface. Based on the inferences about the microstructures at the interfaces, thermodynamic results were calculated to analyze the interfacial reaction mechanism. The diffusion of Cu was limited by the Ni coating and the mutual attraction between the Al and Ni atoms. The microstructure comprised Zn, Ni, and Al, and they replaced the brittle Cu–Zn intermetallic compounds, successfully strengthening the bonding of the FZ/Cu interface.