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Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives pre...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8708833/ https://www.ncbi.nlm.nih.gov/pubmed/34947328 http://dx.doi.org/10.3390/ma14247734 |
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author | Silva, Ângelo D. M. Silva, Mariana M. Figueiredo, Hugo Delgado, Isabel Lopes, Paulo E. Paiva, Maria C. Hilliou, Loic |
author_facet | Silva, Ângelo D. M. Silva, Mariana M. Figueiredo, Hugo Delgado, Isabel Lopes, Paulo E. Paiva, Maria C. Hilliou, Loic |
author_sort | Silva, Ângelo D. M. |
collection | PubMed |
description | Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB. |
format | Online Article Text |
id | pubmed-8708833 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-87088332021-12-25 Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB Silva, Ângelo D. M. Silva, Mariana M. Figueiredo, Hugo Delgado, Isabel Lopes, Paulo E. Paiva, Maria C. Hilliou, Loic Materials (Basel) Article Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB. MDPI 2021-12-15 /pmc/articles/PMC8708833/ /pubmed/34947328 http://dx.doi.org/10.3390/ma14247734 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Silva, Ângelo D. M. Silva, Mariana M. Figueiredo, Hugo Delgado, Isabel Lopes, Paulo E. Paiva, Maria C. Hilliou, Loic Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB |
title | Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB |
title_full | Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB |
title_fullStr | Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB |
title_full_unstemmed | Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB |
title_short | Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB |
title_sort | rheologically assisted design of conductive adhesives for stencil printing on pcb |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8708833/ https://www.ncbi.nlm.nih.gov/pubmed/34947328 http://dx.doi.org/10.3390/ma14247734 |
work_keys_str_mv | AT silvaangelodm rheologicallyassisteddesignofconductiveadhesivesforstencilprintingonpcb AT silvamarianam rheologicallyassisteddesignofconductiveadhesivesforstencilprintingonpcb AT figueiredohugo rheologicallyassisteddesignofconductiveadhesivesforstencilprintingonpcb AT delgadoisabel rheologicallyassisteddesignofconductiveadhesivesforstencilprintingonpcb AT lopespauloe rheologicallyassisteddesignofconductiveadhesivesforstencilprintingonpcb AT paivamariac rheologicallyassisteddesignofconductiveadhesivesforstencilprintingonpcb AT hilliouloic rheologicallyassisteddesignofconductiveadhesivesforstencilprintingonpcb |