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Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB

Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives pre...

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Autores principales: Silva, Ângelo D. M., Silva, Mariana M., Figueiredo, Hugo, Delgado, Isabel, Lopes, Paulo E., Paiva, Maria C., Hilliou, Loic
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8708833/
https://www.ncbi.nlm.nih.gov/pubmed/34947328
http://dx.doi.org/10.3390/ma14247734
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author Silva, Ângelo D. M.
Silva, Mariana M.
Figueiredo, Hugo
Delgado, Isabel
Lopes, Paulo E.
Paiva, Maria C.
Hilliou, Loic
author_facet Silva, Ângelo D. M.
Silva, Mariana M.
Figueiredo, Hugo
Delgado, Isabel
Lopes, Paulo E.
Paiva, Maria C.
Hilliou, Loic
author_sort Silva, Ângelo D. M.
collection PubMed
description Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB.
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spelling pubmed-87088332021-12-25 Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB Silva, Ângelo D. M. Silva, Mariana M. Figueiredo, Hugo Delgado, Isabel Lopes, Paulo E. Paiva, Maria C. Hilliou, Loic Materials (Basel) Article Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB. MDPI 2021-12-15 /pmc/articles/PMC8708833/ /pubmed/34947328 http://dx.doi.org/10.3390/ma14247734 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Silva, Ângelo D. M.
Silva, Mariana M.
Figueiredo, Hugo
Delgado, Isabel
Lopes, Paulo E.
Paiva, Maria C.
Hilliou, Loic
Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
title Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
title_full Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
title_fullStr Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
title_full_unstemmed Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
title_short Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB
title_sort rheologically assisted design of conductive adhesives for stencil printing on pcb
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8708833/
https://www.ncbi.nlm.nih.gov/pubmed/34947328
http://dx.doi.org/10.3390/ma14247734
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