Impedance Spectroscopy Analysis of Thermoelectric Modules Fabricated with Metallic Outer External Layers

[Image: see text] In recent years, thermoelectric (TE) devices have been used in several refrigeration applications and have gained attention for energy generation. To continue the development of devices with higher efficiency, it is necessary not only to characterize their materials but also to optimize device parameters (e.g., thermal contacts). One attempt to increase the efficiency at the device level consists of the replacement of the typical ceramic layers in TE modules by metallic plates, which have higher thermal conductivity. However, this alternative device design requires the use of a very thin electrical insulating layer between the metallic strips that connect the TE legs and the outer external layers, which introduces an additional thermal resistance. Impedance spectroscopy has been proved to be useful to achieve a detailed characterization of TE modules, being even capable to determine the internal thermal contact resistances of the device. For this reason, we use here the impedance method to analyze the device physics of these TE modules with outer metallic plates. We show for the first time that the impedance technique is able to quantify the thermal contact resistances between the metallic strips and the outer layers, which is very challenging for other techniques. Finally, we discuss from our analysis the prospects of using TE modules with external metallic plates.