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Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System
In spite of a high market share of plastic IC packaging, there are still reliability issues, especially for the effects of moisture. The mechanism between moisture and epoxy polymer is still obscure. A multi-step cross-linking approach was used to mimic the cross-linking process between the DGEBA re...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8747217/ https://www.ncbi.nlm.nih.gov/pubmed/35012124 http://dx.doi.org/10.3390/polym14010103 |