Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused therma...

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Autores principales: Kariya, Shingo, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Hayase, Masanori, Higurashi, Eiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8761747/
https://www.ncbi.nlm.nih.gov/pubmed/35087681
http://dx.doi.org/10.1038/s41378-021-00339-x
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author Kariya, Shingo
Matsumae, Takashi
Kurashima, Yuichi
Takagi, Hideki
Hayase, Masanori
Higurashi, Eiji
author_facet Kariya, Shingo
Matsumae, Takashi
Kurashima, Yuichi
Takagi, Hideki
Hayase, Masanori
Higurashi, Eiji
author_sort Kariya, Shingo
collection PubMed
description In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.
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spelling pubmed-87617472022-01-26 Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging Kariya, Shingo Matsumae, Takashi Kurashima, Yuichi Takagi, Hideki Hayase, Masanori Higurashi, Eiji Microsyst Nanoeng Article In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry. Nature Publishing Group UK 2022-01-17 /pmc/articles/PMC8761747/ /pubmed/35087681 http://dx.doi.org/10.1038/s41378-021-00339-x Text en © The Author(s) 2022 https://creativecommons.org/licenses/by/4.0/Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Article
Kariya, Shingo
Matsumae, Takashi
Kurashima, Yuichi
Takagi, Hideki
Hayase, Masanori
Higurashi, Eiji
Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
title Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
title_full Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
title_fullStr Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
title_full_unstemmed Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
title_short Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
title_sort bonding formation and gas absorption using au/pt/ti layers for vacuum packaging
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8761747/
https://www.ncbi.nlm.nih.gov/pubmed/35087681
http://dx.doi.org/10.1038/s41378-021-00339-x
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