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Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused therma...
Autores principales: | Kariya, Shingo, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Hayase, Masanori, Higurashi, Eiji |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8761747/ https://www.ncbi.nlm.nih.gov/pubmed/35087681 http://dx.doi.org/10.1038/s41378-021-00339-x |
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