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Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused therma...

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Detalles Bibliográficos
Autores principales: Kariya, Shingo, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Hayase, Masanori, Higurashi, Eiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8761747/
https://www.ncbi.nlm.nih.gov/pubmed/35087681
http://dx.doi.org/10.1038/s41378-021-00339-x

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