Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes

Thermally conductive adhesives were prepared by incorporating magnesium oxide (MgO) and boron nitride (BN) into fluorosilicone resins. The effects of filler type, size, and shape on thermal conductivity and adhesion properties were analyzed. Higher thermal conductivity was achieved when larger fille...

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Detalles Bibliográficos
Autores principales: Sung, Kyung-Soo, Kim, So-Yeon, Oh, Min-Keun, Kim, Namil
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8777782/
https://www.ncbi.nlm.nih.gov/pubmed/35054666
http://dx.doi.org/10.3390/polym14020258

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8777782/
https://www.ncbi.nlm.nih.gov/pubmed/35054666
http://dx.doi.org/10.3390/polym14020258

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