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Relationship between Thermal Diffusivity and Mechanical Properties of Wood

This paper describes an experimental study of the relationships between thermal diffusivity and mechanical characteristics including Brinell hardness, microhardness, and Young’s modulus of common pine (Pinus sylvestris L.), pedunculate oak (Quercus robur L.), and small-leaf lime (Tilia cordata Mill....

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Detalles Bibliográficos
Autores principales: Golovin, Yuri I., Tyurin, Alexander I., Golovin, Dmitry Yu., Samodurov, Alexander A., Matveev, Sergey M., Yunack, Maria A., Vasyukova, Inna A., Zakharova, Olga V., Rodaev, Vyacheslav V., Gusev, Alexander A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8778518/
https://www.ncbi.nlm.nih.gov/pubmed/35057348
http://dx.doi.org/10.3390/ma15020632
Descripción
Sumario:This paper describes an experimental study of the relationships between thermal diffusivity and mechanical characteristics including Brinell hardness, microhardness, and Young’s modulus of common pine (Pinus sylvestris L.), pedunculate oak (Quercus robur L.), and small-leaf lime (Tilia cordata Mill.) wood. A dependence of Brinell hardness and thermal diffusivity tensor components upon humidity for common pine wood is found. The results of the measurement of Brinell hardness, microhardness, Young’s modulus, and main components of thermal diffusivity tensor for three perpendicular cuts are found to be correlated. It is shown that the mechanical properties correlate better with the ratio of longitude to transversal thermal diffusivity coefficients than with the respective individual absolute values. The mechanical characteristics with the highest correlation with the abovementioned ratio are found to be the ratio of Young’s moduli in longitude and transversal directions. Our technique allows a comparative express assessment of wood mechanical properties by means of a contactless non-destructive measurement of its thermal properties using dynamic thermal imaging instead of laborious and material-consuming destructive mechanical tests.