Advances in Laser Drilling of Structural Ceramics

The high-quality, high-efficiency micro-hole drilling of structural ceramics to improve the thermal conductivity of hot-end parts or achieve high-density electronic packaging is still a technical challenge for conventional processing techniques. Recently, the laser drilling method (LDM) has become the preferred processing tool for structural ceramics, and it plays an irreplaceable role in the industrialized processing of group holes on structural ceramic surfaces. A variety of LDMs such as long pulsed laser drilling, short pulsed laser drilling, ultrafast pulsed laser drilling, liquid-assisted laser drilling, combined pulse laser drilling have been developed to achieved high-quality and high-efficiency micro-hole drilling through controlling the laser–matter interaction. This article reviews the characteristics of different LDMs and systematically compares the morphology, diameter, circularity, taper angle, cross-section, heat affect zone, recast layer, cracks, roughness, micro–nano structure, photothermal effect and photochemical reaction of the drilling. Additionally, exactly what processing parameters and ambient environments are optimal for precise and efficient laser drilling and their recent advancements were analyzed. Finally, a summary and outlook of the LDM technology are also highlighted.