Cargando…
Influence of ultrasonic in low thermal expansion Fe-Ni electrodeposition process for micro-electroforming
The electrochemical mechanism of Fe-Ni electrodeposition under ultrasonic was investigated by electrochemistry methods. Linear scanning voltammetry and cyclic voltammetry were used to show that the deposition process changed from the diffusion control under static conditions to an electrochemical co...
Autores principales: | Li, Anxin, Zhu, Zengwei, Liu, Yapeng, Li, Tianyu |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Elsevier
2021
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8799597/ https://www.ncbi.nlm.nih.gov/pubmed/34974389 http://dx.doi.org/10.1016/j.ultsonch.2021.105894 |
Ejemplares similares
-
Scaling up the fabrication of wafer-scale Ni-MoS(2)/WS(2) nanocomposite moulds using novel intermittent ultrasonic-assisted dual-bath micro-electroforming
por: Guan, Tianyu, et al.
Publicado: (2023) -
A Nickel Dissolution Process for Multilayer Electroforming to Achieve Ultrahigh Adhesion Strength
por: Wang, Zhuangzhuang, et al.
Publicado: (2023) -
An Effect of Layered Auxiliary Cathode on Thickness Uniformity in Micro Electroforming Process
por: Wang, Huan, et al.
Publicado: (2023) -
Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes
por: Schiavone, Giuseppe, et al.
Publicado: (2017) -
Microstructure and Properties of Electrodeposited Nanocrystalline Ni-Co-Fe Coatings
por: Ledwig, Piotr, et al.
Publicado: (2021)