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Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
Antiferroelectric materials have seen a resurgence of interest because of proposed applications in a number of energy-efficient technologies. Unfortunately, relatively few families of antiferroelectric materials have been identified, precluding many proposed applications. Here, we propose a design s...
Autores principales: | , , , , , , , , , , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Association for the Advancement of Science
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8809685/ https://www.ncbi.nlm.nih.gov/pubmed/35108054 http://dx.doi.org/10.1126/sciadv.abg5860 |
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author | Mundy, Julia A. Grosso, Bastien F. Heikes, Colin A. Ferenc Segedin, Dan Wang, Zhe Shao, Yu-Tsun Dai, Cheng Goodge, Berit H. Meier, Quintin N. Nelson, Christopher T. Prasad, Bhagwati Xue, Fei Ganschow, Steffen Muller, David A. Kourkoutis, Lena F. Chen, Long-Qing Ratcliff, William D. Spaldin, Nicola A. Ramesh, Ramamoorthy Schlom, Darrell G. |
author_facet | Mundy, Julia A. Grosso, Bastien F. Heikes, Colin A. Ferenc Segedin, Dan Wang, Zhe Shao, Yu-Tsun Dai, Cheng Goodge, Berit H. Meier, Quintin N. Nelson, Christopher T. Prasad, Bhagwati Xue, Fei Ganschow, Steffen Muller, David A. Kourkoutis, Lena F. Chen, Long-Qing Ratcliff, William D. Spaldin, Nicola A. Ramesh, Ramamoorthy Schlom, Darrell G. |
author_sort | Mundy, Julia A. |
collection | PubMed |
description | Antiferroelectric materials have seen a resurgence of interest because of proposed applications in a number of energy-efficient technologies. Unfortunately, relatively few families of antiferroelectric materials have been identified, precluding many proposed applications. Here, we propose a design strategy for the construction of antiferroelectric materials using interfacial electrostatic engineering. We begin with a ferroelectric material with one of the highest known bulk polarizations, BiFeO(3). By confining thin layers of BiFeO(3) in a dielectric matrix, we show that a metastable antiferroelectric structure can be induced. Application of an electric field reversibly switches between this new phase and a ferroelectric state. The use of electrostatic confinement provides an untapped pathway for the design of engineered antiferroelectric materials with large and potentially coupled responses. |
format | Online Article Text |
id | pubmed-8809685 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | American Association for the Advancement of Science |
record_format | MEDLINE/PubMed |
spelling | pubmed-88096852022-02-16 Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering Mundy, Julia A. Grosso, Bastien F. Heikes, Colin A. Ferenc Segedin, Dan Wang, Zhe Shao, Yu-Tsun Dai, Cheng Goodge, Berit H. Meier, Quintin N. Nelson, Christopher T. Prasad, Bhagwati Xue, Fei Ganschow, Steffen Muller, David A. Kourkoutis, Lena F. Chen, Long-Qing Ratcliff, William D. Spaldin, Nicola A. Ramesh, Ramamoorthy Schlom, Darrell G. Sci Adv Physical and Materials Sciences Antiferroelectric materials have seen a resurgence of interest because of proposed applications in a number of energy-efficient technologies. Unfortunately, relatively few families of antiferroelectric materials have been identified, precluding many proposed applications. Here, we propose a design strategy for the construction of antiferroelectric materials using interfacial electrostatic engineering. We begin with a ferroelectric material with one of the highest known bulk polarizations, BiFeO(3). By confining thin layers of BiFeO(3) in a dielectric matrix, we show that a metastable antiferroelectric structure can be induced. Application of an electric field reversibly switches between this new phase and a ferroelectric state. The use of electrostatic confinement provides an untapped pathway for the design of engineered antiferroelectric materials with large and potentially coupled responses. American Association for the Advancement of Science 2022-02-02 /pmc/articles/PMC8809685/ /pubmed/35108054 http://dx.doi.org/10.1126/sciadv.abg5860 Text en Copyright © 2022 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC). https://creativecommons.org/licenses/by-nc/4.0/This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license (https://creativecommons.org/licenses/by-nc/4.0/) , which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited. |
spellingShingle | Physical and Materials Sciences Mundy, Julia A. Grosso, Bastien F. Heikes, Colin A. Ferenc Segedin, Dan Wang, Zhe Shao, Yu-Tsun Dai, Cheng Goodge, Berit H. Meier, Quintin N. Nelson, Christopher T. Prasad, Bhagwati Xue, Fei Ganschow, Steffen Muller, David A. Kourkoutis, Lena F. Chen, Long-Qing Ratcliff, William D. Spaldin, Nicola A. Ramesh, Ramamoorthy Schlom, Darrell G. Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering |
title | Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering |
title_full | Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering |
title_fullStr | Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering |
title_full_unstemmed | Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering |
title_short | Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering |
title_sort | liberating a hidden antiferroelectric phase with interfacial electrostatic engineering |
topic | Physical and Materials Sciences |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8809685/ https://www.ncbi.nlm.nih.gov/pubmed/35108054 http://dx.doi.org/10.1126/sciadv.abg5860 |
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