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Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering

Antiferroelectric materials have seen a resurgence of interest because of proposed applications in a number of energy-efficient technologies. Unfortunately, relatively few families of antiferroelectric materials have been identified, precluding many proposed applications. Here, we propose a design s...

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Autores principales: Mundy, Julia A., Grosso, Bastien F., Heikes, Colin A., Ferenc Segedin, Dan, Wang, Zhe, Shao, Yu-Tsun, Dai, Cheng, Goodge, Berit H., Meier, Quintin N., Nelson, Christopher T., Prasad, Bhagwati, Xue, Fei, Ganschow, Steffen, Muller, David A., Kourkoutis, Lena F., Chen, Long-Qing, Ratcliff, William D., Spaldin, Nicola A., Ramesh, Ramamoorthy, Schlom, Darrell G.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8809685/
https://www.ncbi.nlm.nih.gov/pubmed/35108054
http://dx.doi.org/10.1126/sciadv.abg5860
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author Mundy, Julia A.
Grosso, Bastien F.
Heikes, Colin A.
Ferenc Segedin, Dan
Wang, Zhe
Shao, Yu-Tsun
Dai, Cheng
Goodge, Berit H.
Meier, Quintin N.
Nelson, Christopher T.
Prasad, Bhagwati
Xue, Fei
Ganschow, Steffen
Muller, David A.
Kourkoutis, Lena F.
Chen, Long-Qing
Ratcliff, William D.
Spaldin, Nicola A.
Ramesh, Ramamoorthy
Schlom, Darrell G.
author_facet Mundy, Julia A.
Grosso, Bastien F.
Heikes, Colin A.
Ferenc Segedin, Dan
Wang, Zhe
Shao, Yu-Tsun
Dai, Cheng
Goodge, Berit H.
Meier, Quintin N.
Nelson, Christopher T.
Prasad, Bhagwati
Xue, Fei
Ganschow, Steffen
Muller, David A.
Kourkoutis, Lena F.
Chen, Long-Qing
Ratcliff, William D.
Spaldin, Nicola A.
Ramesh, Ramamoorthy
Schlom, Darrell G.
author_sort Mundy, Julia A.
collection PubMed
description Antiferroelectric materials have seen a resurgence of interest because of proposed applications in a number of energy-efficient technologies. Unfortunately, relatively few families of antiferroelectric materials have been identified, precluding many proposed applications. Here, we propose a design strategy for the construction of antiferroelectric materials using interfacial electrostatic engineering. We begin with a ferroelectric material with one of the highest known bulk polarizations, BiFeO(3). By confining thin layers of BiFeO(3) in a dielectric matrix, we show that a metastable antiferroelectric structure can be induced. Application of an electric field reversibly switches between this new phase and a ferroelectric state. The use of electrostatic confinement provides an untapped pathway for the design of engineered antiferroelectric materials with large and potentially coupled responses.
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spelling pubmed-88096852022-02-16 Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering Mundy, Julia A. Grosso, Bastien F. Heikes, Colin A. Ferenc Segedin, Dan Wang, Zhe Shao, Yu-Tsun Dai, Cheng Goodge, Berit H. Meier, Quintin N. Nelson, Christopher T. Prasad, Bhagwati Xue, Fei Ganschow, Steffen Muller, David A. Kourkoutis, Lena F. Chen, Long-Qing Ratcliff, William D. Spaldin, Nicola A. Ramesh, Ramamoorthy Schlom, Darrell G. Sci Adv Physical and Materials Sciences Antiferroelectric materials have seen a resurgence of interest because of proposed applications in a number of energy-efficient technologies. Unfortunately, relatively few families of antiferroelectric materials have been identified, precluding many proposed applications. Here, we propose a design strategy for the construction of antiferroelectric materials using interfacial electrostatic engineering. We begin with a ferroelectric material with one of the highest known bulk polarizations, BiFeO(3). By confining thin layers of BiFeO(3) in a dielectric matrix, we show that a metastable antiferroelectric structure can be induced. Application of an electric field reversibly switches between this new phase and a ferroelectric state. The use of electrostatic confinement provides an untapped pathway for the design of engineered antiferroelectric materials with large and potentially coupled responses. American Association for the Advancement of Science 2022-02-02 /pmc/articles/PMC8809685/ /pubmed/35108054 http://dx.doi.org/10.1126/sciadv.abg5860 Text en Copyright © 2022 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC). https://creativecommons.org/licenses/by-nc/4.0/This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license (https://creativecommons.org/licenses/by-nc/4.0/) , which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited.
spellingShingle Physical and Materials Sciences
Mundy, Julia A.
Grosso, Bastien F.
Heikes, Colin A.
Ferenc Segedin, Dan
Wang, Zhe
Shao, Yu-Tsun
Dai, Cheng
Goodge, Berit H.
Meier, Quintin N.
Nelson, Christopher T.
Prasad, Bhagwati
Xue, Fei
Ganschow, Steffen
Muller, David A.
Kourkoutis, Lena F.
Chen, Long-Qing
Ratcliff, William D.
Spaldin, Nicola A.
Ramesh, Ramamoorthy
Schlom, Darrell G.
Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
title Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
title_full Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
title_fullStr Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
title_full_unstemmed Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
title_short Liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
title_sort liberating a hidden antiferroelectric phase with interfacial electrostatic engineering
topic Physical and Materials Sciences
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8809685/
https://www.ncbi.nlm.nih.gov/pubmed/35108054
http://dx.doi.org/10.1126/sciadv.abg5860
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