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Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices
As smaller structures are being increasingly adopted in the semiconductor industry, the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking and stacking strategies. Owing to the increasing complexity of the design archite...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8821559/ https://www.ncbi.nlm.nih.gov/pubmed/35132060 http://dx.doi.org/10.1038/s41377-022-00720-z |