Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material

The current study presents the electron beam melting (EBM) efficiency of copper technogenic material with high impurity content (Se, Te, Pb, Bi, Sn, As, Sb, Zn, Ni, Ag, etc.) by means of thermodynamic analysis and experimental tests. On the basis of the calculated values of Gibbs free energy and the...

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Autores principales: Vutova, Katia, Stefanova, Vladislava, Vassileva, Vania, Kadiyski, Milen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8839568/
https://www.ncbi.nlm.nih.gov/pubmed/35160882
http://dx.doi.org/10.3390/ma15030936
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author Vutova, Katia
Stefanova, Vladislava
Vassileva, Vania
Kadiyski, Milen
author_facet Vutova, Katia
Stefanova, Vladislava
Vassileva, Vania
Kadiyski, Milen
author_sort Vutova, Katia
collection PubMed
description The current study presents the electron beam melting (EBM) efficiency of copper technogenic material with high impurity content (Se, Te, Pb, Bi, Sn, As, Sb, Zn, Ni, Ag, etc.) by means of thermodynamic analysis and experimental tests. On the basis of the calculated values of Gibbs free energy and the physical state of the impurity (liquid and gaseous), a thermodynamic assessment of the possible chemical interactions occurring in the Cu-Cu(2)O-Me(x) system in vacuum in the temperature range 1460–1800 K was made. The impact of the kinetic parameters (temperature and refining time) on the behaviour and the degree of removal of impurities was evaluated. Chemical and metallographic analysis of the obtained ingots is also discussed.
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spelling pubmed-88395682022-02-13 Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material Vutova, Katia Stefanova, Vladislava Vassileva, Vania Kadiyski, Milen Materials (Basel) Article The current study presents the electron beam melting (EBM) efficiency of copper technogenic material with high impurity content (Se, Te, Pb, Bi, Sn, As, Sb, Zn, Ni, Ag, etc.) by means of thermodynamic analysis and experimental tests. On the basis of the calculated values of Gibbs free energy and the physical state of the impurity (liquid and gaseous), a thermodynamic assessment of the possible chemical interactions occurring in the Cu-Cu(2)O-Me(x) system in vacuum in the temperature range 1460–1800 K was made. The impact of the kinetic parameters (temperature and refining time) on the behaviour and the degree of removal of impurities was evaluated. Chemical and metallographic analysis of the obtained ingots is also discussed. MDPI 2022-01-26 /pmc/articles/PMC8839568/ /pubmed/35160882 http://dx.doi.org/10.3390/ma15030936 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Vutova, Katia
Stefanova, Vladislava
Vassileva, Vania
Kadiyski, Milen
Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material
title Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material
title_full Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material
title_fullStr Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material
title_full_unstemmed Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material
title_short Behaviour of Impurities during Electron Beam Melting of Copper Technogenic Material
title_sort behaviour of impurities during electron beam melting of copper technogenic material
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8839568/
https://www.ncbi.nlm.nih.gov/pubmed/35160882
http://dx.doi.org/10.3390/ma15030936
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AT vassilevavania behaviourofimpuritiesduringelectronbeammeltingofcoppertechnogenicmaterial
AT kadiyskimilen behaviourofimpuritiesduringelectronbeammeltingofcoppertechnogenicmaterial

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