Surface Cleaning Effect of Bare Aluminum Micro-Sized Powder by Low Oxygen Induction Thermal Plasma

The development of bare metal powder is desirable for obtaining conductive interfaces by low-temperature sintering to be applied in various industries of 3D printing, conductive ink or paste. In our previous study, bulk Al made from Al nanopowder that was prepared with low-oxygen thermal plasma (LO-ITP), which is the original metal powder production technique, showed high electrical conductivity comparable to Al casting material. This study discusses the surface cleaning effect of Al particles expected to be obtained by peeling the surface of Al particles using the LO-ITP method. Bare metal micro-sized powders were prepared using LO-ITP by controlling the power supply rate and preferentially vaporizing the oxidized surface of the Al powder. Electrical conductivity was evaluated to confirm if there was an oxide layer at the Al/Al interface. The Al compact at room temperature produced from LO-ITP-processed Al powder showed an electrical conductivity of 2.9 · 10(7) S/m, which is comparable to that of cast Al bulk. According to the microstructure observation, especially for the interfaces between bare Al powder, direct contact was achieved at 450 °C sintering. This process temperature is lower than the conventional sintering temperature (550 °C) of commercial Al powder without any surface cleaning. Therefore, surface cleaning using LO-ITP is the key to opening a new gate to the powder metallurgy process.