Investigation of the Contact Characteristics of Silicon–Gold in an Anodic Bonding Structure

Anodic bonding is broadly utilized to realize the structure support and electrical connection in the process of fabrication and packaging of MEMS devices, and the mechanical and electrical characteristics of the bonded interface of structure exhibit a significant impact on the stability and reliabil...

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Detalles Bibliográficos
Autores principales: Zhang, Lin, Cao, Kaicong, Ran, Longqi, Yu, Huijun, Zhou, Wu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8877159/
https://www.ncbi.nlm.nih.gov/pubmed/35208388
http://dx.doi.org/10.3390/mi13020264

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8877159/
https://www.ncbi.nlm.nih.gov/pubmed/35208388
http://dx.doi.org/10.3390/mi13020264

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