Cargando…
Investigation of the Contact Characteristics of Silicon–Gold in an Anodic Bonding Structure
Anodic bonding is broadly utilized to realize the structure support and electrical connection in the process of fabrication and packaging of MEMS devices, and the mechanical and electrical characteristics of the bonded interface of structure exhibit a significant impact on the stability and reliabil...
| Autores principales: | , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8877159/ https://www.ncbi.nlm.nih.gov/pubmed/35208388 http://dx.doi.org/10.3390/mi13020264 |