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Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review
Two-dimensional (2D) materials are widely used in microelectronic devices due to their excellent optical, electrical, and mechanical properties. The performance and reliability of microelectronic devices based 2D materials are affected by heat dissipation performance, which can be evaluated by study...
Autores principales: | , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8877908/ https://www.ncbi.nlm.nih.gov/pubmed/35214918 http://dx.doi.org/10.3390/nano12040589 |
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author | Dai, Huanyu Wang, Ridong |
author_facet | Dai, Huanyu Wang, Ridong |
author_sort | Dai, Huanyu |
collection | PubMed |
description | Two-dimensional (2D) materials are widely used in microelectronic devices due to their excellent optical, electrical, and mechanical properties. The performance and reliability of microelectronic devices based 2D materials are affected by heat dissipation performance, which can be evaluated by studying the thermal conductivity of 2D materials. Currently, many theoretical and experimental methods have been developed to characterize the thermal conductivity of 2D materials. In this paper, firstly, typical theoretical methods, such as molecular dynamics, phonon Boltzmann transport equation, and atomic Green’s function method, are introduced and compared. Then, experimental methods, such as suspended micro-bridge, 3ω, time-domain thermal reflectance and Raman methods, are systematically and critically reviewed. In addition, the physical factors affecting the thermal conductivity of 2D materials are discussed. At last, future prospects for both theoretical and experimental thermal conductivity characterization of 2D materials is given. This paper provides an in-depth understanding of the existing thermal conductivity measurement methods of 2D materials, which has guiding significance for the application of 2D materials in micro/nanodevices. |
format | Online Article Text |
id | pubmed-8877908 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-88779082022-02-26 Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review Dai, Huanyu Wang, Ridong Nanomaterials (Basel) Review Two-dimensional (2D) materials are widely used in microelectronic devices due to their excellent optical, electrical, and mechanical properties. The performance and reliability of microelectronic devices based 2D materials are affected by heat dissipation performance, which can be evaluated by studying the thermal conductivity of 2D materials. Currently, many theoretical and experimental methods have been developed to characterize the thermal conductivity of 2D materials. In this paper, firstly, typical theoretical methods, such as molecular dynamics, phonon Boltzmann transport equation, and atomic Green’s function method, are introduced and compared. Then, experimental methods, such as suspended micro-bridge, 3ω, time-domain thermal reflectance and Raman methods, are systematically and critically reviewed. In addition, the physical factors affecting the thermal conductivity of 2D materials are discussed. At last, future prospects for both theoretical and experimental thermal conductivity characterization of 2D materials is given. This paper provides an in-depth understanding of the existing thermal conductivity measurement methods of 2D materials, which has guiding significance for the application of 2D materials in micro/nanodevices. MDPI 2022-02-09 /pmc/articles/PMC8877908/ /pubmed/35214918 http://dx.doi.org/10.3390/nano12040589 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Review Dai, Huanyu Wang, Ridong Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review |
title | Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review |
title_full | Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review |
title_fullStr | Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review |
title_full_unstemmed | Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review |
title_short | Methods for Measuring Thermal Conductivity of Two-Dimensional Materials: A Review |
title_sort | methods for measuring thermal conductivity of two-dimensional materials: a review |
topic | Review |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8877908/ https://www.ncbi.nlm.nih.gov/pubmed/35214918 http://dx.doi.org/10.3390/nano12040589 |
work_keys_str_mv | AT daihuanyu methodsformeasuringthermalconductivityoftwodimensionalmaterialsareview AT wangridong methodsformeasuringthermalconductivityoftwodimensionalmaterialsareview |