Coupling Analysis on Microstructure and Residual Stress in Selective Laser Melting (SLM) with Varying Key Process Parameters

With the application of Selective Laser Melting (SLM) technology becoming more and more widespread, it is important to note the process parameters that have a very important effect on the forming quality. Key process parameters such as laser power (P), scan speed (s), and scanning strategy (μ) were investigated by determining the correlation between the microstructure and residual stress in this paper. A total of 10 group 316L specimens were fabricated using SLM for comprehensive analysis. The results show that the key process parameters directly affect the morphology and size of the molten pool in the SLM deposition, and the big molten pool width has a direct effect on the larger grain size and crystal orientation distribution. In addition, the larger grain size and misorientation angle also affect the size of the residual stress. Therefore, better additive manufacturing grain crystallization can be obtained by reasonably adjusting the process parameter combinations. The transfer energy density can synthesize the influence of four key process parameters (P, v, the hatching distance (δ), and the layer thickness (h)). In this study, it is proposed that the accepted energy density will reflect the influence of five key process parameters, including the scanning trajectory (μ), which can reflect the comprehensive effect of process parameters more accurately.