Effect of Electroless Cu Plating Ti(3)AlC(2) Particles on Microstructure and Properties of Gd(2)O(3)/Cu Composites

Ti(3)AlC(2) presents a hexagonal layered crystal structure and bridges the gap between metallic and ceramic properties, and Gadolinia (Gd(2)O(3)) has excellent thermodynamic stability, which make them potentially attractive as dispersive phases for Cu matrix composites. In this paper, Cu@Ti(3)AlC(2)-Gd(2)O(3)/Cu composites, Ti(3)AlC(2)-Gd(2)O(3)/Cu composites, and Gd(2)O(3)/Cu composites were prepared by electroless Cu plating, internal oxidation, and vacuum hot press sintering. The microstructure and the effect of the Cu plating on the properties of the Cu@Ti(3)AlC(2)-Gd(2)O(3)/Cu composites were discussed. The results showed that a Cu plating with a thickness of about 0.67 μm was successfully plated onto the surface of Ti(3)AlC(2) particles. The ex situ Ti(3)AlC(2) particles were distributed at the Cu grain boundary, while the in situ Gd(2)O(3) particles with a grain size of 20 nm were dispersed in the Cu grains. The electroless Cu plating onto the surface of the Ti(3)AlC(2) particles effectively reduces their surfactivity and improves the surface contacting state between the Cu@Ti(3)AlC(2) particles and the Cu matrix, and reduces electron scattering, so that the tensile strength reached 378.9 MPa, meanwhile, the electrical conductivity and elongation of the Cu matrix composites was maintained at 93.6 IACS% and 17.6%.