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Damage-tolerant material design motif derived from asymmetrical rotation

Motifs extracted from nature can lead to significant advances in materials design and have been used to tackle the apparent exclusivity between strength and damage tolerance of brittle materials. Here we present a segmental design motif found in arthropod exoskeleton, in which asymmetrical rotationa...

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Detalles Bibliográficos
Autores principales: Wang, Wei, Chen, Shu Jian, Chen, Weiqiang, Duan, Wenhui, Lai, Jia Zie, Sagoe-Crentsil, Kwesi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8917193/
https://www.ncbi.nlm.nih.gov/pubmed/35277518
http://dx.doi.org/10.1038/s41467-022-28991-5
Descripción
Sumario:Motifs extracted from nature can lead to significant advances in materials design and have been used to tackle the apparent exclusivity between strength and damage tolerance of brittle materials. Here we present a segmental design motif found in arthropod exoskeleton, in which asymmetrical rotational degree of freedom is used in damage control in contrast to the conventional interfacial shear failure mechanism of existing design motifs. We realise this design motif in a compression-resisting lightweight brittle material, demonstrating a unique progressive failure behaviour that preserves material integrity with 60–80% of load-bearing capacity at >50% of compressive strain. This rotational degree of freedom further enables a periodic energy absorbance pattern during failure yielding 200% higher strength than the corresponding cellular structure and up to 97.9% reduction of post-damage residual stress compared with ductile materials. Fifty material combinations covering 27 types of materials analysed display potential progressive failure behaviour by this design motif, thereby establishing a broad spectrum of potential applications of the design motif for advanced materials design, energy storage/conversion and architectural structures.