High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)

Printed Electronics Recent progress in electronics has expanded their applicability in various fields in which structural conformability and 3D configuration are required. High‐resolution 3D printing technologies for forming dynamic electronic structures are of increasing interest. More details can...

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Detalles Bibliográficos
Autores principales: Park, Young‐Geun, Yun, Insik, Chung, Won Gi, Park, Wonjung, Lee, Dong Ha, Park, Jang‐Ung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2022
Materias:
Cover Picture
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8922092/
http://dx.doi.org/10.1002/advs.202270046
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author Park, Young‐Geun
Yun, Insik
Chung, Won Gi
Park, Wonjung
Lee, Dong Ha
Park, Jang‐Ung
author_facet Park, Young‐Geun
Yun, Insik
Chung, Won Gi
Park, Wonjung
Lee, Dong Ha
Park, Jang‐Ung
author_sort Park, Young‐Geun
collection PubMed
description Printed Electronics Recent progress in electronics has expanded their applicability in various fields in which structural conformability and 3D configuration are required. High‐resolution 3D printing technologies for forming dynamic electronic structures are of increasing interest. More details can be found in article number 2104623 by Jang‐Ung Park and co‐workers. [Image: see text]
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spelling pubmed-89220922022-03-21 High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022) Park, Young‐Geun Yun, Insik Chung, Won Gi Park, Wonjung Lee, Dong Ha Park, Jang‐Ung Adv Sci (Weinh) Cover Picture Printed Electronics Recent progress in electronics has expanded their applicability in various fields in which structural conformability and 3D configuration are required. High‐resolution 3D printing technologies for forming dynamic electronic structures are of increasing interest. More details can be found in article number 2104623 by Jang‐Ung Park and co‐workers. [Image: see text] John Wiley and Sons Inc. 2022-03-15 /pmc/articles/PMC8922092/ http://dx.doi.org/10.1002/advs.202270046 Text en © 2022 Wiley‐VCH GmbH https://creativecommons.org/licenses/by-nc/4.0/This is an open access article under the terms of the http://creativecommons.org/licenses/by-nc/4.0/ (https://creativecommons.org/licenses/by-nc/4.0/) License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited and is not used for commercial purposes.
spellingShingle Cover Picture
Park, Young‐Geun
Yun, Insik
Chung, Won Gi
Park, Wonjung
Lee, Dong Ha
Park, Jang‐Ung
High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)
title High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)
title_full High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)
title_fullStr High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)
title_full_unstemmed High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)
title_short High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)
title_sort high‐resolution 3d printing for electronics (adv. sci. 8/2022)
topic Cover Picture
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8922092/
http://dx.doi.org/10.1002/advs.202270046
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AT parkwonjung highresolution3dprintingforelectronicsadvsci82022
AT leedongha highresolution3dprintingforelectronicsadvsci82022
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