Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM

With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurri...

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Autores principales: Kim, Myeongjin, Park, Hyun Soon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Singapore 2022
Materias:
Technical Report
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8960543/
https://www.ncbi.nlm.nih.gov/pubmed/35347484
http://dx.doi.org/10.1186/s42649-022-00071-4
_version_ 1784677401080365056
author Kim, Myeongjin
Park, Hyun Soon
author_facet Kim, Myeongjin
Park, Hyun Soon
author_sort Kim, Myeongjin
collection PubMed
description With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps.
format Online
Article
Text
id pubmed-8960543
institution National Center for Biotechnology Information
language English
publishDate 2022
publisher Springer Singapore
record_format MEDLINE/PubMed
spelling pubmed-89605432022-04-12 Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM Kim, Myeongjin Park, Hyun Soon Appl Microsc Technical Report With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps. Springer Singapore 2022-03-28 /pmc/articles/PMC8960543/ /pubmed/35347484 http://dx.doi.org/10.1186/s42649-022-00071-4 Text en © The Author(s) 2022 https://creativecommons.org/licenses/by/4.0/Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Technical Report
Kim, Myeongjin
Park, Hyun Soon
Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
title Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
title_full Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
title_fullStr Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
title_full_unstemmed Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
title_short Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM
title_sort microstructure analysis of 8 μm electrolytic cu foil in plane view using ebsd and tem
topic Technical Report
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8960543/
https://www.ncbi.nlm.nih.gov/pubmed/35347484
http://dx.doi.org/10.1186/s42649-022-00071-4
work_keys_str_mv AT kimmyeongjin microstructureanalysisof8mmelectrolyticcufoilinplaneviewusingebsdandtem
AT parkhyunsoon microstructureanalysisof8mmelectrolyticcufoilinplaneviewusingebsdandtem

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