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On-chip integration of bulk micromachined three-dimensional Si/C/CNT@TiC micro-supercapacitors for alternating current line filtering

Three-dimensional (3D) micro-supercapacitors (MSCs) with superior performances are desirable for miniaturized electronic devices. 3D interdigitated MSCs fabricated by bulk micromachining technologies have been demonstrated for silicon wafers. However, rational design and fabrication technologies of...

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Detalles Bibliográficos
Autores principales: Wang, Yurong, Du, Huanhuan, Xiao, Dongyang, Zhang, Yili, Hu, Fangjing, Sun, Leimeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8979127/
https://www.ncbi.nlm.nih.gov/pubmed/35425244
http://dx.doi.org/10.1039/d1ra08456a