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High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor

Polymer dielectrics with ultra-high charge–discharge rates are significant for advanced electrical and electronic systems. Despite the fact that polymers possess high breakdown strength, the low dielectric constant (k) of polymers gives rise to low energy densities. Incorporating metal into polyimid...

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Detalles Bibliográficos
Autores principales: Alamri, Abdullah, Wu, Chao, Nasreen, Shamima, Tran, Huan, Yassin, Omer, Gentile, Ryan, Kamal, Deepak, Ramprasad, Rampi, Cao, Yang, Sotzing, Gregory
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8985109/
https://www.ncbi.nlm.nih.gov/pubmed/35424840
http://dx.doi.org/10.1039/d1ra06302b
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author Alamri, Abdullah
Wu, Chao
Nasreen, Shamima
Tran, Huan
Yassin, Omer
Gentile, Ryan
Kamal, Deepak
Ramprasad, Rampi
Cao, Yang
Sotzing, Gregory
author_facet Alamri, Abdullah
Wu, Chao
Nasreen, Shamima
Tran, Huan
Yassin, Omer
Gentile, Ryan
Kamal, Deepak
Ramprasad, Rampi
Cao, Yang
Sotzing, Gregory
author_sort Alamri, Abdullah
collection PubMed
description Polymer dielectrics with ultra-high charge–discharge rates are significant for advanced electrical and electronic systems. Despite the fact that polymers possess high breakdown strength, the low dielectric constant (k) of polymers gives rise to low energy densities. Incorporating metal into polyimides (PI) at the polyamic acid (PAA) precursor stage of the synthetic process is a cheap and versatile way to improve the dielectric constant of the hybrid system while maintaining a high breakdown strength. Here, we explore inclusion of different percentages of Sn as a coordinated complex in a polyimide matrix to achieve metal homogeneity within the dielectric film to boost dielectric constant. Sn–O bonds with high atomic polarizability are intended to enhance the ionic polarization without sacrificing bandgap, a measurable property of the material to assess intrinsic breakdown strength. Enhancements of k from ca. 3.7 to 5.7 were achieved in going from the pure PI film to films containing 10 mol% tin.
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spelling pubmed-89851092022-04-13 High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor Alamri, Abdullah Wu, Chao Nasreen, Shamima Tran, Huan Yassin, Omer Gentile, Ryan Kamal, Deepak Ramprasad, Rampi Cao, Yang Sotzing, Gregory RSC Adv Chemistry Polymer dielectrics with ultra-high charge–discharge rates are significant for advanced electrical and electronic systems. Despite the fact that polymers possess high breakdown strength, the low dielectric constant (k) of polymers gives rise to low energy densities. Incorporating metal into polyimides (PI) at the polyamic acid (PAA) precursor stage of the synthetic process is a cheap and versatile way to improve the dielectric constant of the hybrid system while maintaining a high breakdown strength. Here, we explore inclusion of different percentages of Sn as a coordinated complex in a polyimide matrix to achieve metal homogeneity within the dielectric film to boost dielectric constant. Sn–O bonds with high atomic polarizability are intended to enhance the ionic polarization without sacrificing bandgap, a measurable property of the material to assess intrinsic breakdown strength. Enhancements of k from ca. 3.7 to 5.7 were achieved in going from the pure PI film to films containing 10 mol% tin. The Royal Society of Chemistry 2022-03-23 /pmc/articles/PMC8985109/ /pubmed/35424840 http://dx.doi.org/10.1039/d1ra06302b Text en This journal is © The Royal Society of Chemistry https://creativecommons.org/licenses/by/3.0/
spellingShingle Chemistry
Alamri, Abdullah
Wu, Chao
Nasreen, Shamima
Tran, Huan
Yassin, Omer
Gentile, Ryan
Kamal, Deepak
Ramprasad, Rampi
Cao, Yang
Sotzing, Gregory
High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor
title High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor
title_full High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor
title_fullStr High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor
title_full_unstemmed High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor
title_short High dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor
title_sort high dielectric constant and high breakdown strength polyimide via tin complexation of the polyamide acid precursor
topic Chemistry
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8985109/
https://www.ncbi.nlm.nih.gov/pubmed/35424840
http://dx.doi.org/10.1039/d1ra06302b
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