Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium

As a traditional interconnect material, silver alloy bonding wires are widely used in electronic packaging, but their propensity to vulcanize quickly has not been sufficiently addressed. The current surface anti-oxidation and anti-sulfidation treatments are often accompanied by a decline in bonding...

Descripción completa

Detalles Bibliográficos
Autores principales: Yang, Guannan, Zhou, Zhiqiang, Zhang, Haide, Zhang, Yu, Peng, Zhen, Gong, Pan, Wang, Xin, Cui, Chengqiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8999782/
https://www.ncbi.nlm.nih.gov/pubmed/35407687
http://dx.doi.org/10.3390/ma15072355

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8999782/
https://www.ncbi.nlm.nih.gov/pubmed/35407687
http://dx.doi.org/10.3390/ma15072355

Ejemplares similares