Cargando…

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Ball shear testing is an efficient approach to investigate the mechanical reliability of solder joints at the structural level. In the present study, a series of low-speed ball shear tests were conducted to study the deformation and fracture characteristics of Sn96.5Ag3Cu0.5 solder joints at continu...

Descripción completa

Detalles Bibliográficos
Autores principales:	Liang, Kun, Wang, Yuexing, He, Zhigang
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9000201/ https://www.ncbi.nlm.nih.gov/pubmed/35407786 http://dx.doi.org/10.3390/ma15072455

Ejemplares similares

Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
por: Leong, Yee Mei, et al.
Publicado: (2016)

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin
por: Zhang, Peng, et al.
Publicado: (2022)

Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints
por: Chen, Dongdong, et al.
Publicado: (2022)

Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow
por: Zaimi, Nur Syahirah Mohamad, et al.
Publicado: (2022)

Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
por: Zhang, Liang, et al.
Publicado: (2017)

Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2019)

Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration
por: Yue, Wu, et al.
Publicado: (2021)

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints
por: Fu, Xing, et al.
Publicado: (2020)

Author Correction: Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2020)

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
por: Mi, Jinhua, et al.
Publicado: (2014)

Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates
por: Xiao, Jin, et al.
Publicado: (2023)

The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
por: Kang, Min-Soo, et al.
Publicado: (2019)

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
por: Choi, Gwang-Mun, et al.
Publicado: (2021)

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder
por: Li, Chaojun, et al.
Publicado: (2020)

Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints
por: Zhang, Yuanxiang, et al.
Publicado: (2022)

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
por: Cui, Jianguo, et al.
Publicado: (2021)

Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate during Solid-state Aging
por: Shen, Yu-An, et al.
Publicado: (2019)

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints
por: Zhang, Chao, et al.
Publicado: (2023)

Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range
por: Yakymovych, A., et al.
Publicado: (2017)

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
por: Zaimi, Nur Syahirah Mohamad, et al.
Publicado: (2021)

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate
por: Son, Junhyuk, et al.
Publicado: (2021)

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging
por: Xin, Meiling, et al.
Publicado: (2022)

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2023)

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO(2) and Al(2)O(3) Nanoparticles at Different Reflow Times
por: Mohamed Muzni, Nur Haslinda, et al.
Publicado: (2023)

Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures
por: Chen, Chaoyu, et al.
Publicado: (2022)

The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
por: Sayyadi, Reza, et al.
Publicado: (2019)

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading
por: Li, Zhigang, et al.
Publicado: (2023)

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
por: Ramli, Mohd Izrul Izwan, et al.
Publicado: (2021)

Hybrid solder joints: the effect of nanosized ZrO(2) particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints
por: Wodak, Irina, et al.
Publicado: (2023)

Imaging the Polymorphic Transformation in a Single Cu(6)Sn(5) Grain in a Solder Joint
por: Somidin, Flora, et al.
Publicado: (2018)

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
por: Ting Tan, Ai, et al.
Publicado: (2015)

Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
por: Huang, M. L., et al.
Publicado: (2014)

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2021)

Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis
por: Zhang, Meng, et al.
Publicado: (2019)

Giant Rugby Ball [{Cp(Bn)Fe(η(5)-P(5))}(24)Cu(96)Br(96)] Derived from Pentaphosphaferrocene and CuBr(2)
por: Heindl, Claudia, et al.
Publicado: (2015)

Effects of Static Heat and Dynamic Current on Al/Zn∙Cu/Sn Solder/Ag Interfaces of Sn Photovoltaic Al-Ribbon Modules
por: Chen, Kuan-Jen, et al.
Publicado: (2018)

Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
por: Kang, Min-Soo, et al.
Publicado: (2019)

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging
por: Zhao, Di, et al.
Publicado: (2020)

Creep Behavior of a Sn-Ag-Bi Pb-Free Solder
por: Vianco, Paul, et al.
Publicado: (2012)

96.5 Using Computer Vision-Based Algorithms Trained on Mobile-Device Camera Images for Monitoring Burn Wound Healing
por: Chan, Hannah O, et al.
Publicado: (2022)

Cannot write session to /tmp/vufind_sessions/sess_959ii2dm00vaqmvh10hbb9r6if