Synthesis and Properties Comparison of Low Dielectric Silicon Containing Polyimides

Recent studies have shown that the introduction of silicon can effectively improve the dielectric properties of polyimide (PI), and the introduction of a silicon–oxygen bond can increase the flexibility of the PI molecular structure, which is conducive to reducing the moisture absorption rate of PI...

Descripción completa

Detalles Bibliográficos
Autores principales: Chen, Yuwei, Liu, Yidong, Min, Yonggang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9032192/
https://www.ncbi.nlm.nih.gov/pubmed/35454447
http://dx.doi.org/10.3390/ma15082755

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9032192/
https://www.ncbi.nlm.nih.gov/pubmed/35454447
http://dx.doi.org/10.3390/ma15082755

Ejemplares similares