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Controllable fabrication and self-assembly of Cu nanostructures: the role of Cu(2+) complexes

The controllable fabrication of low dimensional nanostructures and the assembly of nanostructures into hierarchical higher order structures at the atomic or molecular level have been two hot-spots of current nano research. In this work, the fabrication and self-assembly of Cu nanostructures were car...

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Detalles Bibliográficos
Autores principales: Yang, Lan, Su, Jiangbin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9033198/
https://www.ncbi.nlm.nih.gov/pubmed/35480168
http://dx.doi.org/10.1039/d1ra02408f
Descripción
Sumario:The controllable fabrication of low dimensional nanostructures and the assembly of nanostructures into hierarchical higher order structures at the atomic or molecular level have been two hot-spots of current nano research. In this work, the fabrication and self-assembly of Cu nanostructures were carried out by reducing Cu(2+) complexes in a mixed aqueous solution of NaOH and hydrazine hydrate at a water bath temperature of 60 °C. The reduction products were characterized using a metalloscope, a scanning electron microscope, a transmission electron microscope and a powder X-ray diffractometer. It was found that the fabrication and self-assembly of Cu nanostructures can be easily realized by controlling the types of Cu(2+) complexes such as [Cu(OH)(4)](2−), [Cu(EDA)(2)](2+) and [Cu(EDA)(OH)(2)]. The authors further analyzed the important roles of Cu(2+) complexes in the fabrication and self-assembly of Cu nanostructures. It was concluded that the Cu(2+) complexes in the aqueous solution would spontaneously arrange into a certain soft template according to the principle of “like dissolves like” and the action of electrostatic forces of positive and negative charges. The as-formed templates determine the fabrication and self-assembly routes and the final products of the Cu nanostructures. Therefore, it provides a controllable and universal method for both fabrication and self-assembly of Cu nanostructures, which may have potential applications in the fields of electronic and optoelectronic nanodevices in the future.