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Zirconia/phenylsiloxane nano-composite for LED encapsulation with high and stable light extraction efficiency

To obtain a rapid processible LED encapsulant that leads to high and stable light extraction efficiency (LEE), UV curable ZrO(2)/phenyl-siloxane nano-composite (ZSC) double-layer encapsulants were prepared and optimized. The highly crystalline ZrO(2) nanoparticles with a diameter of ∼14 nm were synt...

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Detalles Bibliográficos
Autores principales: Lu, Ying, Zhao, Zhihang, Fan, Xianpeng, Cao, Xinyu, Hai, Mingtan, Yang, Zhou, Zheng, Kun, Lu, Jiaxin, Zhang, Jingnan, Ma, Yongmei, Zhang, Rongben, Fang, Shibi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9033391/
https://www.ncbi.nlm.nih.gov/pubmed/35480915
http://dx.doi.org/10.1039/d1ra02230j
Descripción
Sumario:To obtain a rapid processible LED encapsulant that leads to high and stable light extraction efficiency (LEE), UV curable ZrO(2)/phenyl-siloxane nano-composite (ZSC) double-layer encapsulants were prepared and optimized. The highly crystalline ZrO(2) nanoparticles with a diameter of ∼14 nm were synthesized through a modified hydrothermal method at mild conditions, and a UV curable methacryl-diphenyl-polysiloxane (MDPS) with a refractive index (RI) of 1.54 (at 633 nm) was synthesized from self-condensation of diphenylsilanediol and an end-capping reaction. High refractive indexes (RIs) from 1.54–1.61 have been obtained for ZSC composites by adding 0–20 wt% ZrO(2). Before and after sulfur vapor erosion, the double-layer encapsulated sample (M-10/M) showed 11.2% and 64.8% higher LEE respectively than that of Dow Corning OE-7662. Meanwhile, the variation of LED light color temperature (T(c)) was less than 1%. The effect of the ZrO(2) nanoparticle content on LEE of double-layer and single-layer encapsulation were compared and discussed based on Fresnel loss and Rayleigh scattering theories. The double-layered UV curing processing took only 1/6 of the time needed for common thermal curing.