Artificial intelligence deep learning for 3D IC reliability prediction

Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly influenced by voids and failure in interconnects during the fabrication processes,...

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Detalles Bibliográficos
Autores principales: Hsu, Po-Ning, Shie, Kai-Cheng, Chen, Kuan-Peng, Tu, Jing-Chen, Wu, Cheng-Che, Tsou, Nien-Ti, Lo, Yu-Chieh, Chen, Nan-Yow, Hsieh, Yong-Fen, Wu, Mia, Chen, Chih, Tu, King-Ning
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9035975/
https://www.ncbi.nlm.nih.gov/pubmed/35468910
http://dx.doi.org/10.1038/s41598-022-08179-z

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9035975/
https://www.ncbi.nlm.nih.gov/pubmed/35468910
http://dx.doi.org/10.1038/s41598-022-08179-z

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