Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field

In the electrochemical migration behavior (ECM) of printed circuit boards containing mold under a static magnetic field (SMF), the role of the field perpendicular to the electrodes is discussed; the B field inhibits the growth and metabolism of mold, while controlling electrochemical diffusion and n...

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Detalles Bibliográficos
Autores principales: Liu, Xuan, Bai, Ziheng, Liu, Qianqian, Feng, Yali, Dong, Chaofang, Lu, Lin, Luo, Hong, Wang, Jirui, Zou, Shiwen, Xiao, Kui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2021
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9038071/
https://www.ncbi.nlm.nih.gov/pubmed/35480762
http://dx.doi.org/10.1039/d1ra03776e

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9038071/
https://www.ncbi.nlm.nih.gov/pubmed/35480762
http://dx.doi.org/10.1039/d1ra03776e

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